〖 Description 〗

　　The semiconductor manufacturing capacity in Asia has been rising with major contributions from the pure-play foundries and makers of memory. The increasing interest by the IDMs in the fab-lite model will continue to drive this growth. The region is also attracting investments from European and US IDMs.
　　This report provides the semiconductor manufacturing capacity of Asia as a whole and of individual countries with a five-year forecast. It also provides an overview of 300mm capacity in the region. In addition, it highlights the details such as capacity, process technologies, and wafer size for all the leading fabs in the region.


〖 Contents 〗

• Executive Summary
• Introduction
• Asia Foundry Overview
o Factors Driving Semiconductor Capacity in Asia
• 300mm Fabs in Asia
• Semiconductor Process Development Alliances and Joint Ventures
• Asia Capex Overview
• Asia Semiconductor Manufacturing Capacity by Country, 2006–2011
o Asia Semiconductor Manufacturing Capacity
o Foundry Process Technology Comparison
• Taiwan Semiconductor Manufacturing Overview
o TSMC
o UMC
o Powerchip Semiconductor Corporation (PSC)
o ProMOS Technologies
o Winbond
o Nanya Technology and Inotera Memory
• South Korea Semiconductor Manufacturing Overview
o Samsung
o Hynix
o MagnaChip
o DongbuAnam
 Drivers
 Challenges
• China Semiconductor Manufacturing Overview
o SMIC
 Drivers
 Challenges
• Singapore Semiconductor Manufacturing Overview
o Chartered
 Drivers
 Challenges
• Japan Semiconductor Manufacturing Overview
o Drivers
o Challenges
• Malaysia Semiconductor Manufacturing Overview
o Drivers
o Challenges
• Others
o India
 Drivers
 Challenges
o Vietnam
 Drivers
 Challenges
• Conclusion
• Methodology
• Related In-Stat Reports
List of Tables
• Table 1. Asia 300mm Fabs, 2006
• Table 2. Asia Upcoming 300mm Fabs
• Table 3. Asia Foundry Capital Expenditure, 2003–2007, (US$ in Billions)
• Table 4. Asia Memory Capital Expenditure, 2003–2007 (US$ in Billions)
• Table 5. TSMC Fabs Overview
• Table 6. TSMC Process Technology Trend, 2003–2007
• Table 7. UMC Fabs Overview
• Table 8. UMC Process Technology Trend, 2003–2007
• Table 9. Taiwan Memory Fabs Overview
• Table 10. Samsung Fabs Overview
• Table 11. Hynix Fabs Overview
• Table 12. MagnaChip Fabs Overview
• Table 13. DongbuAnam Fabs Overview
• Table 14. SMIC Fabs Overview
• Table 15. SMIC Process Technology Trend, 2003–2007
• Table 16. Other Leading Fabs in China
• Table 17. Chartered Fabs Overview
• Table 18. Chartered Process Technology Trend, 2003–2007
• Table 19. Singapore Other Leading Fabs
• Table 20. Japan 300mm Fabs Overview
• Table 21. Malaysia Fabs Overview
List of Figures
• Figure 1. Asia Semiconductor Manufacturing Capacity, 2006 (200mm-eq. Wafers/Month, in Thousands)
• Figure 2. 300mm Wafer Share in Asia Semiconductor Manufacturing Capacity, 2006 (in 200mm-eq. Wafers)
• Figure 3. Asia Foundry Capital Expenditure, 2003–2007, (US$ in Billions)
• Figure 4. Asia Memory Capital Expenditure, 2003–2007, (US$ in Billions)
• Figure 5. Asia Semiconductor Manufacturing Capacity, 2006–2011 (200mm-eq. Wafers/Month, in Thousands)
• Figure 6. Foundry Capacity Comparison by Process Technology, 2006
• Figure 7. Taiwan Semiconductor Manufacturing Capacity, 2006–2011 (200mm-eq. Wafers/Month, in Thousands)
• Figure 8. TSMC Process Technology Trend, 2003–2007
• Figure 9. UMC Process Technology Trend, 2003–2007
• Figure 10. South Korea Semiconductor Manufacturing Capacity, 2006–2011 (200mm-eq. Wafers/Month, in Thousands)
• Figure 11. China Semiconductor Manufacturing Capacity, 2006–2011 (200mm-eq. Wafers/Month, in Thousands)
• Figure 12. SMIC Process Technology Trend, 2003–2007
• Figure 13. Singapore Semiconductor Manufacturing Capacity, 2006–2011 (200mm-eq. Wafers/Month, in Thousands)
• Figure 14. Chartered Process Technology Trend, 2003–2007
• Figure 15. Japan Semiconductor Manufacturing Capacity, 2006–2011 (200mm-eq. Wafers/Month, in Thousands)
• Figure 16. Malaysia Semiconductor Manufacturing Capacity, 2006–2011 (8-inch-eq. Wafers/Month, in Thousands)