摘要

Why is the ultra mobile device (UMD) segment so important? Because it is likely to be the next billion units of gold for semiconductor and consumer electronics vendors, while driving a new level of innovation through communication standards, Internet applications, and service and usage models.

This report examines one of the most critical issues in the UMD market: the battle between processor architectures, which are the hearts and brains of these new devices. The leading contenders in this battle include the x86 camp, led by Intel, and the ARM camp, led by companies like Freescale, NVIDIA, Qualcomm, Samsung, and Texas Instruments.

The following information is included in the report:

目录及图表

Executive Summary
Introduction
A Tale of Two Architectures: x86 vs. ARM
Intel
ARM
Background
Major ARM Licensees
Texas Instruments (TI)
Freescale
Qualcomm
NVIDIA
Samsung
VIA Technologies
VIA’s Mobile and Ultra-Mobile Microprocessors
VIA C7-M
VIA Nano
Others
AMD
STMicroelectronics
Conclusion
Methodology
Intel’s Wafer Capacity
Glossary
List of Tables
List of Figures
Related In-Stat Reports
List of Tables
Table 1. Intel Fabrication Facilities and Estimated Wafer Capacities
Table 2. Intel Atom Microprocessors
Table 3. System Controller Hubs (SCHs) for the Centrino Atom Platform
Table 4. Matrix of Atom Microprocessors to System Controller Hubs (SCHs)/Chipsets
Table 5. ARM Cortex-A8 and Cortex-A9 (MP and Single) Microprocessor Cores
Table 6. ARM 11 Microprocessor Cores
Table 7. ARM 9 Microprocessor Cores
Table 8. ARM Cortex Microprocessor Cores
Table 9. Freescale i.MX Applications Processor Product Line
Table 10. Qualcomm Snapdragon Applications Processors
Table 11. NVIDIA Tegra SoCs
Table 12. Samsung Applications Processors
Table 13. VIA C7-M Microprocessors
Table 14. VIA Nano Microprocessors
Table 15. STMicroelectronics Nomadik Applications Processors
List of Figures
Figure 1. The Internet Touches Nearly All Aspects of Consumers’ Lives
Figure 2. Paradigms: Increasing Miniaturization and Portability and Increasing Integration
Figure 3. Block Diagram of the Intel Atom Low-Power Microprocessor
Figure 4. Block Diagram of the Intel Poulsbo Chipset (Now Referred to as the System Controller Hub)
Figure 5. Block Diagram of the Intel Moorestown Platform
Figure 6. ARM’s Royalty Split between Vertical Markets During 1Q08
Figure 7. Block Diagram of the Texas Instruments ARM Cortex-A8-Based OMAP3430/OMAP3420
Figure 8. Block Diagram of the Texas Instruments OMAP3410 Applications Processor
Figure 9. Block Diagram of the Texas Instruments OMAP3440 Applications Processor
Figure 10. Block Diagram of the Freescale i.MXS Applications Processor
Figure 11. Block Diagram of the Freescale i.MXL Applications Processor
Figure 12. Block Diagram of the Freescale i.MX21(S) Applications Processor
Figure 13. Block Diagram of the Freescale i.MX27 Applications Processor
Figure 14. Block Diagram of the Freescale i.MX31(L) Applications Processor
Figure 15. Block Diagram of the Freescale i.MX32 Applications Processor
Figure 16. Block Diagram of the Freescale i.MX37 Applications Processor
Figure 17. Block Diagram of the Qualcomm Scorpion Microprocessor Core
Figure 18. Block Diagram of the Qualcomm Snapdragon System-on-a-Chip
Figure 19. Block Diagram of the NVIDIA Tegra System-on-a-Chip
Figure 20. Block Diagram of the Samsung S3C2412 Applications Processor
Figure 21. Block Diagram of the Samsung S3C2413 Applications Processor
Figure 22. Block Diagram of the Samsung S3C2443 Applications Processor
Figure 23. Block Diagram of the Samsung S3C6400 Applications Processor
Figure 24. Block Diagram of the Samsung S3C6410 Applications Processor
Figure 25. Block Diagram of the VIA C7-M Microprocessor (Based on Die Plot)
Figure 26. Block Diagram of the VIA Nano Microprocessor (Based on Die Plot)
Figure 27. Block Diagram of the AMD Forthcoming Shrike Mobile Platform